单项选择题
A.顶层(Top Layer)B.底层(Bottom Layer)C.顶层丝印层(Top Overlay)D.中间层(Midldle Layer)
A.执行“文件”→“装配输出”→Generatepick and placefles命令B.执行“文件”→“装配输出”,ANcmbly Dawings命令C.执行“文件”→“辅助制造输出”→Generate pick and place files命令D.执行“文件”→辅助制造输出”Asembly Drawings命令
A.插针式封装与无引脚封装B.插针式封装与表贴式封装C.无引脚式封装与表贴式封装D.无引脚式封装、插针式封装与表贴式封装