单项选择题
A.DPAKB.CHIPC.WIRE WOUNDD.MOLDED
A.工业计算机标准(Industrial Personal Computer)B.工业用电路板(Industrial Printed Circuits)C.工业元件封装(Industrial Packaging Components)D.印刷电路板协会(Institute of Printed Circuits)
A.Small Outline Packages(SOP)B.Leadless Chip Carriers(LCC)C.Quad Packs(QUAD)D.Ball Grid Arrays(BGA)